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HSEC8-190-03-L-DV-A-K

Samtec Inc.
RoHS
RoHS RoHS compliant
Package /
Category Connectors, Interconnects / Card Edge Connectors - Edgeboard Connectors
Description Card Edgeboard Connector
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Technical Details

Supply Chain

Factory Lead Time 3 Weeks

Physical

Contact Material Beryllium Copper
Mounting Type Surface Mount
Material - Insulation Liquid Crystal Polymer (LCP)

Technical

Operating Temperature -55°C~125°C
Packaging Bulk
Series Edge Rate? HSEC8
Feature Board Guide
Part Status Active
Termination Solder
Connector Type CARD EDGE CONNECTOR
Number of Positions 180
Color Black
Number of Rows 2
Gender Female
Contact Type Cantilever
Pitch 0.031 0.80mm
Contact Finish Gold
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 90

Dimensions

Contact Finish Thickness 10.0μin 0.25μm
Card Thickness 0.093 2.36mm

Compliance

RoHS Status ROHS3 Compliant
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