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XCV812E-7FG900C

Xilinx Inc.
RoHS
/
Package 900-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Virtex?-E EM XCV812E 900-BBGA Surface Mount field programmable gate array 2.6mm 1.8V 400MHz 0.42ns
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900

Dimensions

Height Seated (Max) 2.6mm
Length 31mm
Width 31mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 1999
Series Virtex?-E EM
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV812E
Pin Count 900
Number of Outputs 556
Operating Supply Voltage 1.8V
Number of I/O 556
RAM Size 140kB
Clock Frequency 400MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 21168
Total RAM Bits 1146880
Number of Gates 254016
Number of LABs/CLBs 4704
Speed Grade 7
Combinatorial Delay of a CLB-Max 0.42 ns

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