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XC3S1000L-4FGG676C

Xilinx Inc.
RoHS
/
Package 676-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 391 I/O 676FBGA
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 1999
Series Spartan?-3L
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 1.14V~1.26V
Base Part Number XC3S1000L
Number of I/O 391
RAM Size 54kB
Number of Logic Elements/Cells 17280
Total RAM Bits 442368
Number of Gates 1000000
Number of LABs/CLBs 480
Number of Logic Blocks (LABs) 480

Compliance

RoHS Status RoHS Compliant
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