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XC2V250-4FG456I

Xilinx Inc.
RoHS
/
Package 456-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Virtex?-II XC2V250 456-BBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.6mm 1.5V 650MHz 54kB
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 456-BBGA
Number of Pins 456

Dimensions

Height Seated (Max) 2.6mm
Length 23mm
Width 23mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2007
Series Virtex?-II
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 456
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.425V~1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC2V250
Pin Count 456
Number of Outputs 200
Operating Supply Voltage 1.5V
Power Supplies 1.51.5/3.33.3V
Number of I/O 200
RAM Size 54kB
Clock Frequency 650MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 442368
Number of Gates 250000
Number of LABs/CLBs 384
Speed Grade 4
Number of Registers 3072
Number of CLBs 384

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