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Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description EC LFEC3 256-BGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.1mm 1.2V 420MHz 0.4ns
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256

Dimensions

Height Seated (Max) 2.1mm
Length 17mm
Width 17mm

Compliance

RoHS Status RoHS Compliant
Lead Free Lead Free

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2006
Series EC
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number LFEC3
Pin Count 256
Number of Outputs 160
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.33.3V
Memory Size 8.4kB
Number of I/O 160
RAM Size 6.9kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 3100
Total RAM Bits 56320
Max Frequency 420MHz
Number of Logic Blocks (LABs) 384
Combinatorial Delay of a CLB-Max 0.4 ns
Number of CLBs 384
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