A3P600-1PQ208I

Microsemi Corporation

RoHS

Package 208-BFQFP

Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)

Description ProASIC3 A3P600 208-BFQFP Tin/Lead (Sn/Pb) field programmable gate array 3.4mm 1.5V 272MHz 13.5kB

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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Lifecycle Status OBSOLETE (Last Updated: 1 month ago)

Physical

Mount Surface Mount

Mounting Type Surface Mount

Package / Case 208-BFQFP

Number of Pins 208

Technical

Operating Temperature -40°C~100°C TJ

Packaging Tray

Published 2009

Series ProASIC3

JESD-609 Code e0

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 208

Terminal Finish Tin/Lead (Sn/Pb)

Technology CMOS

Voltage - Supply 1.425V~1.575V

Terminal Position QUAD

Terminal Form GULL WING

Peak Reflow Temperature (Cel) 225

Supply Voltage 1.5V

Terminal Pitch 0.5mm

Time@Peak Reflow Temperature-Max (s) 30

Base Part Number A3P600

Operating Supply Voltage 1.5V

Number of I/O 154

RAM Size 13.5kB

Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY

Total RAM Bits 110592

Number of Gates 600000

Max Frequency 272MHz

Speed Grade 1

Number of Registers 13824

Dimensions

Height 3.4mm

Length 28mm

Width 28mm

Compliance

Radiation Hardening No

RoHS Status Non-RoHS Compliant

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