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Package 900-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ECP2 LFE2-70 900-BBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.6mm 1.2V 420MHz 0.304ns
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900

Dimensions

Height Seated (Max) 2.6mm
Length 31mm
Width 31mm

Compliance

RoHS Status Non-RoHS Compliant
Lead Free Lead Free

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2012
Series ECP2
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFE2-70
Pin Count 900
Number of Outputs 583
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Memory Size 146kB
Number of I/O 583
RAM Size 129kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 68000
Total RAM Bits 1056768
Max Frequency 420MHz
Number of LABs/CLBs 8500
Combinatorial Delay of a CLB-Max 0.304 ns
Number of Logic Cells 70000
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