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Package 900-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ECP2M LFE2M50 900-BBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.6mm 1.2V 311MHz 0.358ns
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900

Dimensions

Height Seated (Max) 2.6mm
Length 31mm
Width 31mm

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2012
Series ECP2M
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFE2M50
Pin Count 900
Number of Outputs 410
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Memory Size 531kB
Number of I/O 410
RAM Size 518.4kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 48000
Total RAM Bits 4246528
Max Frequency 311MHz
Number of LABs/CLBs 6000
Combinatorial Delay of a CLB-Max 0.358 ns
Number of Logic Cells 50000

Compliance

RoHS Status Non-RoHS Compliant
Lead Free Lead Free
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