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XCV1000E-8FG900C
Xilinx Inc.RoHS
/
Package 900-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Virtex?-E XCV1000E 900-BBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.6mm 1.8V 416MHz 0.4ns
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Technical Details
Physical
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 1999
Series Virtex?-E
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV1000E
Pin Count 900
Number of Outputs 660
Operating Supply Voltage 1.8V
Number of I/O 660
RAM Size 48kB
Clock Frequency 416MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 27648
Total RAM Bits 393216
Number of Gates 1569178
Number of LABs/CLBs 6144
Speed Grade 8
Combinatorial Delay of a CLB-Max 0.4 ns
Number of Equivalent Gates 331776
Compliance
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Dimensions
Height Seated (Max) 2.6mm
Length 31mm
Width 31mm
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