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XCV150-5BG352C
Xilinx Inc.RoHS
/
Package 352-LBGA Exposed Pad, Metal
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
IC FPGA 260 I/O 352MBGA
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Technical Details
Physical
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 352-LBGA Exposed Pad, Metal
Supplier Device Package 352-MBGA (35x35)
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2002
Series Virtex?
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 2.375V~2.625V
Base Part Number XCV150
Operating Supply Voltage 2.5V
Number of I/O 260
RAM Size 6kB
Number of Logic Elements/Cells 3888
Total RAM Bits 49152
Number of Gates 164674
Number of LABs/CLBs 864
Number of Logic Blocks (LABs) 864
Speed Grade 5
Compliance
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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