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XCV1600E-6BG560C

Xilinx Inc.
RoHS
/
Package 560-LBGA Exposed Pad, Metal
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Virtex?-E XCV1600E 560-LBGA Exposed Pad Metal Surface Mount field programmable gate array 1.7mm 1.8V 357MHz 0.47ns
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal

Dimensions

Height Seated (Max) 1.7mm
Length 42.5mm
Width 42.5mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 1999
Series Virtex?-E
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV1600E
Pin Count 560
Number of Outputs 404
Operating Supply Voltage 1.8V
Number of I/O 404
RAM Size 72kB
Clock Frequency 357MHz
Number of Inputs 404
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of Gates 2188742
Number of LABs/CLBs 7776
Speed Grade 6
Combinatorial Delay of a CLB-Max 0.47 ns
Number of Equivalent Gates 419904
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