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Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description 1216CLBS XP LFXP10 256-BGA field programmable gate array 2.1mm 1.2V 320MHz 0.63ns
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256

Dimensions

Height Seated (Max) 2.1mm
Length 17mm
Width 17mm

Compliance

RoHS Status Non-RoHS Compliant
Lead Free Lead Free

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2007
Series XP
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFXP10
Pin Count 256
Number of Outputs 188
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Memory Size 31.9kB
Number of I/O 188
RAM Size 27kB
Organization 1216 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 10000
Total RAM Bits 221184
Max Frequency 320MHz
Number of Logic Blocks (LABs) 1250
Combinatorial Delay of a CLB-Max 0.63 ns
Number of CLBs 1216
Number of Logic Cells 1216
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