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XC3S200-5FT256C

Xilinx Inc.
RoHS
/
Package 256-LBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Spartan?-3 XC3S200 256-LBGA Tin/Lead (Sn63Pb37) field programmable gate array 17mm 1.2V 27kB 0C~85C TJ
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 1998
Series Spartan?-3
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S200
Pin Count 256
Number of Outputs 173
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Number of I/O 173
RAM Size 27kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4320
Total RAM Bits 221184
Number of Gates 200000
Number of LABs/CLBs 480
Speed Grade 5
Number of CLBs 480

Dimensions

Length 17mm
Width 17mm

Compliance

RoHS Status Non-RoHS Compliant

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