M2GL060-1FCS325

Microsemi Corporation

RoHS

Package 325-TFBGA

Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)

Description 2015 Non-RoHS Compliant BALL Active field programmable gate array 0C~85C TJ 1.2V

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Inventory: 2880

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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)

Physical

Mounting Type Surface Mount

Package / Case 325-TFBGA

Surface Mount YES

Technical

Operating Temperature 0°C~85°C TJ

Packaging Tray

Published 2015

Series IGLOO2

Part Status Active

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 325

HTS Code 8542.39.00.01

Voltage - Supply 1.14V~2.625V

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 240

Supply Voltage 1.2V

Time@Peak Reflow Temperature-Max (s) 20

JESD-30 Code S-PBGA-B325

Number of I/O 200

Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells 56520

Total RAM Bits 1869824

Compliance

RoHS Status Non-RoHS Compliant

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