SN74LVC2G241YEPR

Rochester Electronics, LLC

RoHS

Package 8-XFBGA, DSBGA

Category Integrated Circuits (ICs) / Logic - Buffers, Drivers, Receivers, Transceivers

Description Tape & Reel (TR) TIN LEAD 74LVC LVC/LCX/Z logic buffer 32mA 32mA 8.8ns 0.5mm 1.8V

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Technical Details

Physical

Mounting Type Surface Mount

Package / Case 8-XFBGA, DSBGA

Surface Mount YES

Dimensions

Height Seated (Max) 0.5mm

Width 0.9mm

Compliance

RoHS Status Non-RoHS Compliant

Technical

Operating Temperature -40°C~125°C TA

Packaging Tape & Reel (TR)

Series 74LVC

JESD-609 Code e0

Pbfree Code no

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 8

Terminal Finish TIN LEAD

Technology CMOS

Voltage - Supply 1.65V~5.5V

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 260

Number of Functions 2

Supply Voltage 1.8V

Terminal Pitch 0.5mm

Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Pin Count 8

JESD-30 Code R-XBGA-B8

Output Type 3-State

Number of Elements 2

Supply Voltage-Max (Vsup) 5.5V

Number of Ports 2

Family LVC/LCX/Z

Current - Output High, Low 32mA 32mA

Logic Type Buffer, Non-Inverting

Output Polarity TRUE

Number of Bits per Element 1

Propagation Delay (tpd) 8.8 ns

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