SN74AUC2G34YEPR

Rochester Electronics, LLC

RoHS

Package 6-XFBGA, DSBGA

Category Integrated Circuits (ICs) / Logic - Buffers, Drivers, Receivers, Transceivers

Description Tape & Reel (TR) TIN LEAD 74AUC AUC logic buffer 9mA 9mA 3.4ns 0.5mm 1.2V

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Technical Details

Physical

Mounting Type Surface Mount

Package / Case 6-XFBGA, DSBGA

Surface Mount YES

Technical

Operating Temperature -40°C~85°C TA

Packaging Tape & Reel (TR)

Series 74AUC

JESD-609 Code e0

Pbfree Code yes

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 6

Terminal Finish TIN LEAD

Technology CMOS

Voltage - Supply 0.8V~2.7V

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 260

Number of Functions 2

Supply Voltage 1.2V

Terminal Pitch 0.5mm

Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Pin Count 6

JESD-30 Code R-XBGA-B6

Output Type Push-Pull

Number of Elements 2

Supply Voltage-Min (Vsup) 0.8V

Family AUC

Number of Inputs 1

Output Characteristics 3-STATE

Current - Output High, Low 9mA 9mA

Logic Type Buffer, Non-Inverting

Number of Bits per Element 1

Propagation Delay (tpd) 3.4 ns

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Height Seated (Max) 0.5mm

Width 0.9mm

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