SN74LVC2G07YEPR

Rochester Electronics, LLC

RoHS

Package 6-XFBGA, DSBGA

Category Integrated Circuits (ICs) / Logic - Buffers, Drivers, Receivers, Transceivers

Description Tape & Reel (TR) TIN LEAD 74LVC LVC/LCX/Z logic buffer - 32mA 8.6ns 0.5mm 3.3V

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Technical Details

Physical

Mounting Type Surface Mount

Package / Case 6-XFBGA, DSBGA

Surface Mount YES

Technical

Operating Temperature -40°C~125°C TA

Packaging Tape & Reel (TR)

Series 74LVC

JESD-609 Code e0

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 6

Terminal Finish TIN LEAD

Technology CMOS

Voltage - Supply 1.65V~5.5V

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 260

Number of Functions 2

Supply Voltage 3.3V

Terminal Pitch 0.5mm

Reach Compliance Code unknown

Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Pin Count 6

JESD-30 Code R-XBGA-B6

Output Type Open Drain

Number of Elements 2

Supply Voltage-Max (Vsup) 5.5V

Family LVC/LCX/Z

Number of Inputs 1

Current - Output High, Low - 32mA

Logic Type Buffer, Non-Inverting

Number of Bits per Element 1

Propagation Delay (tpd) 8.6 ns

Dimensions

Height Seated (Max) 0.5mm

Width 0.9mm

Compliance

RoHS Status Non-RoHS Compliant

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