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RoHS
RoHS RoHS compliant
Package 1156-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ECP3 LFE3-70 1156-BBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.6mm 1.2V 375MHz 0.379ns
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1156-BBGA
Number of Pins 1156

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2012
Series ECP3
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFE3-70
Number of Outputs 490
Qualification Status Not Qualified
Power Supplies 1.2V
Number of I/O 490
RAM Size 552.5kB
Clock Frequency 375MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 67000
Total RAM Bits 4526080
Number of LABs/CLBs 8375
Combinatorial Delay of a CLB-Max 0.379 ns

Dimensions

Height Seated (Max) 2.6mm
Length 35mm
Width 35mm

Compliance

RoHS Status ROHS3 Compliant
Lead Free Lead Free
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