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RoHS
RoHS RoHS compliant
Package 672-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description XP2 LFXP2-30 672-BBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 2.6mm 1.2V 435MHz 0.304ns
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 672-BBGA
Number of Pins 672

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2013
Series XP2
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 672
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFXP2-30
Pin Count 672
Number of Outputs 472
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.33.3V
Memory Size 55.4kB
Number of I/O 472
RAM Size 48.4kB
Clock Frequency 435MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 29000
Total RAM Bits 396288
Number of LABs/CLBs 3625
Combinatorial Delay of a CLB-Max 0.304 ns

Dimensions

Height Seated (Max) 2.6mm
Length 27mm
Width 27mm

Compliance

Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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