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M2GL050-1FG896I

Microsemi Corporation
RoHS
/
Package 896-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 377 I/O 896FBGA
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Inventory: 3732
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Technical Details

Supply Chain

Factory Lead Time 9 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)

Physical

Mounting Type Surface Mount
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series IGLOO2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Voltage - Supply 1.14V~2.625V
Base Part Number M2GL050
Number of I/O 377
RAM Size 228.3kB
Number of Logic Elements/Cells 56340
Total RAM Bits 1869824

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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