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APA600-FG676

Microsemi Corporation
RoHS
/
Package 676-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ProASICPLUS APA600 676-BGA Tin/Lead (Sn/Pb) field programmable gate array 1.73mm 2.5V 180MHz 15.8kB
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Technical Details

Supply Chain

Factory Lead Time 18 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676
Weight 400.011771mg

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2007
Series ProASICPLUS
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.3V~2.7V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 180MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number APA600
Number of Outputs 454
Operating Supply Voltage 2.5V
Power Supplies 2.52.5/3.3V
Number of I/O 454
RAM Size 15.8kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 129024
Number of Gates 600000
Number of Registers 21504

Dimensions

Height 1.73mm
Length 27mm
Width 27mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant

Alternative Model

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