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APA600-FG676

Microsemi Corporation
RoHS
/
Package 676-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ProASICPLUS APA600 676-BGA Tin/Lead (Sn/Pb) field programmable gate array 1.73mm 2.5V 180MHz 15.8kB
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Technical Details

Supply Chain

Factory Lead Time 18 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676
Weight 400.011771mg

Dimensions

Height 1.73mm
Length 27mm
Width 27mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2007
Series ProASICPLUS
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.3V~2.7V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 180MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number APA600
Number of Outputs 454
Operating Supply Voltage 2.5V
Power Supplies 2.52.5/3.3V
Number of I/O 454
RAM Size 15.8kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 129024
Number of Gates 600000
Number of Registers 21504

Alternative Model

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