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XCKU095-2FFVB1760E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 1760-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Copper Silver Tin CMOS 2012 ROHS3Compliant field programmable gate array 0C~100C TJ 7.4MB 950mV 3.71mm
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA

Technical

Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2012
Series Kintex? UltraScale?
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Subcategory Field Programmable Gate Arrays
Packing Method TRAY
Technology CMOS
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1760
Number of Outputs 702
Qualification Status Not Qualified
Operating Supply Voltage 950mV
Power Supplies 0.95V
Number of I/O 702
RAM Size 7.4MB
Number of Inputs 702
Organization 768 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1176000
Total RAM Bits 60518400
Number of LABs/CLBs 67200
Speed Grade 2
Number of Registers 1.0752e+06
Number of CLBs 768

Dimensions

Height Seated (Max) 3.71mm

Compliance

RoHS Status ROHS3 Compliant
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