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APA600-CQ208B

Microsemi Corporation
RoHS
/
Package 208-BFCQFP with Tie Bar
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ProASICPLUS APA600 208-BFCQFP with Tie Bar Tin/Lead (Sn/Pb) field programmable gate array 3.3mm 2.5V 5MHz 15.8kB
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Technical Details

Supply Chain

Factory Lead Time 26 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 208-BFCQFP with Tie Bar
Number of Pins 208

Dimensions

Height Seated (Max) 3.3mm
Length 29.21mm
Width 29.21mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant

Technical

Operating Temperature -55°C~125°C TJ
Packaging Tray
Published 2007
Series ProASICPLUS
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.3V~2.7V
Terminal Position QUAD
Terminal Form FLAT
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number APA600
Number of Outputs 158
Operating Supply Voltage 2.5V
Power Supplies 2.52.5/3.3V
Number of I/O 158
RAM Size 15.8kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 129024
Number of Gates 600000
Max Frequency 5MHz
Screening Level MIL-STD-883 Class B
Number of Registers 21504
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