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M1AFS600-FG256K

Microsemi Corporation
RoHS
/
Package 256-LBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 119 I/O 256FBGA
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)

Technical

Operating Temperature -55°C~100°C TJ
Packaging Tray
Published 2013
Series Fusion?
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -55°C
Voltage - Supply 1.425V~1.575V
Base Part Number M1AFS600
Number of I/O 119
RAM Size 13.5kB
Total RAM Bits 110592
Number of Gates 600000

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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