XCVU125-3FLVC2104E

Xilinx Inc.

RoHS

RoHS compliant

Package 2104-BBGA, FCBGA

Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)

Description Copper Silver Tin ROHS3Compliant BALL Active field programmable gate array 0C~100C TJ 11.1MB 1V

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Inventory: 5780

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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Contact Plating Copper, Silver, Tin

Mount Surface Mount

Mounting Type Surface Mount

Package / Case 2104-BBGA, FCBGA

Technical

Operating Temperature 0°C~100°C TJ

Packaging Tray

Series Virtex? UltraScale?

JESD-609 Code e1

Part Status Active

Moisture Sensitivity Level (MSL) 4 (72 Hours)

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

Voltage - Supply 0.970V~1.030V

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) NOT SPECIFIED

Supply Voltage 1V

Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

JESD-30 Code S-PBGA-B2104

Number of I/O 416

RAM Size 11.1MB

Organization 1200 CLBS

Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells 1566600

Total RAM Bits 90726400

Number of LABs/CLBs 89520

Speed Grade 3

Number of Registers 1.43232e+06

Number of CLBs 1200

Compliance

RoHS Status ROHS3 Compliant

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