XCVU190-3FLGA2577E

Xilinx Inc.

RoHS

RoHS compliant

Package 2577-BBGA, FCBGA

Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)

Description ROHS3Compliant BALL Active BOTTOM field programmable gate array 0C~100C TJ 1V 4.01mm

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Inventory: 5003

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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Mounting Type Surface Mount

Package / Case 2577-BBGA, FCBGA

Surface Mount YES

Technical

Operating Temperature 0°C~100°C TJ

Packaging Tray

Series Virtex? UltraScale?

JESD-609 Code e1

Part Status Active

Moisture Sensitivity Level (MSL) 4 (72 Hours)

ECCN Code 3A001.A.7.B

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

HTS Code 8542.39.00.01

Voltage - Supply 0.970V~1.030V

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) NOT SPECIFIED

Supply Voltage 1V

Terminal Pitch 1mm

Reach Compliance Code not_compliant

Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

JESD-30 Code S-PBGA-B2577

Number of I/O 448

Organization 1800 CLBS

Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells 2349900

Total RAM Bits 150937600

Number of LABs/CLBs 134280

Number of CLBs 1800

Dimensions

Height Seated (Max) 4.01mm

Length 52.5mm

Width 52.5mm

Compliance

RoHS Status ROHS3 Compliant

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