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10M04DAF256C7G

Intel
RoHS
RoHS RoHS compliant
Package 256-LBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description MAX? 10 256-LBGA Tin/Silver/Copper (Sn/Ag/Cu) Surface Mount field programmable gate array 1.55mm 1.2V 0C~85C TJ
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Mounting Type Surface Mount
Package / Case 256-LBGA
Surface Mount YES
Manufacturer Package Identifier FBGA-1517-A:350-D1:34.10

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX? 10
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 178
Qualification Status Not Qualified
Power Supplies 1.2V
Number of I/O 178
Number of Inputs 178
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4000
Total RAM Bits 193536
Number of LABs/CLBs 250
Max Junction Temperature (Tj) 125°C

Compliance

RoHS Status RoHS Compliant

Dimensions

Height 1.55mm
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