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RoHS
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Package 672-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 472 I/O 672FPBGA
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 672-BBGA
Number of Pins 672
Supplier Device Package 672-FPBGA (27x27)

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series XP2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Voltage - Supply 1.14V~1.26V
Base Part Number LFXP2-30
Number of I/O 472
RAM Size 48.4kB
Number of Logic Elements/Cells 29000
Total RAM Bits 396288
Number of LABs/CLBs 3625
Number of Logic Blocks (LABs) 3625

Compliance

RoHS Status Non-RoHS Compliant
Lead Free Lead Free
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