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LFXP6E-5F256C
Lattice Semiconductor CorporationRoHS
/
Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
XP LFXP6 256-BGA Tin/Lead (Sn63Pb37) field programmable gate array 17mm 1.2V 400MHz 0.44ns
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Technical Details
Physical
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-BGA
Number of Pins 256
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2010
Series XP
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFXP6
Pin Count 256
Number of Outputs 188
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Memory Size 11.9kB
Number of I/O 188
RAM Size 9kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 6000
Total RAM Bits 73728
Number of Gates 2
Max Frequency 400MHz
Number of Logic Blocks (LABs) 750
Combinatorial Delay of a CLB-Max 0.44 ns
Number of CLBs 720
Number of Logic Cells 720
Dimensions
Length 17mm
Width 17mm
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Lead Free
Alternative Model
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