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EPF8820ABC225-2

Intel
RoHS
/
Package 225-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description REGISTERED CMOS Non-RoHS Compliant BALL field programmable gate array 0C~70C TA 417MHz 3.3/55V 2.3mm
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 225-BGA
Surface Mount YES

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
Series FLEX 8000
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 4.75V~5.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 5V
Terminal Pitch 1.5mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B225
Number of Outputs 148
Qualification Status Not Qualified
Power Supplies 3.3/55V
Number of I/O 152
Clock Frequency 417MHz
Number of Inputs 152
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 672
Number of Gates 8000
Number of LABs/CLBs 84
Output Function REGISTERED
Number of Logic Cells 672
Number of Dedicated Inputs 4

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Height Seated (Max) 2.3mm
Length 27mm
Width 27mm

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