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0447642002

Molex
RoHS
RoHS RoHS compliant
Package /
Category Connectors, Interconnects / Rectangular Connectors - Headers, Receptacles, Female Sockets
Description Conn Wire to Board RCP 20 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI? Tray
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Technical Details

Supply Chain

Factory Lead Time 13 Weeks

Physical

Contact Material Phosphor Bronze
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled

Technical

Operating Temperature -40°C~105°C
Packaging Tray
Series Micro-Fit 3.0 BMI 44764
JESD-609 Code e3
Feature Board Guide
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle
Number of Positions 20
Applications General Purpose, Telecommunications
Number of Rows 2
Voltage - Rated 600VAC
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Current Rating (Amps) 5A
Terminal Pitch 3mm
Insulation Height 0.402 10.20mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.118 3.00mm
Insulation Color Black
Row Spacing - Mating 0.118 (3.00mm)
Contact Length - Post 0.155 3.94mm
Contact Finish - Post Tin
UL Flammability Code 94V-0

Compliance

Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant

Dimensions

Contact Finish Thickness - Mating 15.0μin 0.38μm
Contact Finish Thickness - Post 100.0μin 2.54μm
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