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55737-001

Amphenol ICC (FCI)
RoHS
/
Package /
Category Connectors, Interconnects / Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Description Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
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Inventory: 4724
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Contact Material COPPER ALLOY
Contact Plating GXT, Gold
Mount Surface Mount
Mounting Type Surface Mount
Housing Material Polymer

Dimensions

Length 38.2mm
Height Above Board 0.380 9.64mm
Stack Height (Mating) 15mm 20mm 25mm

Compliance

RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

Technical

Packaging Tray
Published 2011
Series GIG-Array?, MezzSelect?
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Differential Pair Array, Male
Number of Positions 200 Signal (100 Pair)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Rows 18
Voltage - Rated 500V
HTS Code 8536.69.40.40
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Option GENERAL PURPOSE
Pitch 0.051 1.30mm
Orientation Straight
Depth 28.6mm
Current Rating 1A
Contact Finish Gold or Gold, GXT?
Number of Contacts 200
Insulation Resistance 1GOhm
Body/Shell Style PLUG
Max Voltage Rating (AC) 500V

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