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10026802-001LF

Amphenol ICC (FCI)
RoHS
RoHS RoHS compliant
Package /
Category Connectors, Interconnects / Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Description Conn High Density PL 200 POS 1.3mm Solder ST SMD Tray
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Inventory: 1496
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Contact Material COPPER ALLOY
Contact Plating Copper, GXT, Gold, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Housing Material Polymer

Dimensions

Length 38.2mm
Contact Finish Thickness 30.0μin 0.76μm
Height Above Board 0.458 11.64mm
Stack Height (Mating) 17mm 22mm 27mm

Compliance

RoHS Status RoHS Compliant

Technical

Packaging Tray
Series GIG-Array?, MezzSelect?
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Differential Pair Array, Male
Number of Positions 200 Signal (100 Pair)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Rows 18
Voltage - Rated 500V
HTS Code 8536.69.40.40
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Option GENERAL PURPOSE
Pitch 0.051 1.30mm
Orientation Straight
Depth 25.5mm
Current Rating 1A
Contact Finish Gold or Gold, GXT?
Number of Contacts 200
Insulation Resistance 1GOhm
Body/Shell Style PLUG

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