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Category Connectors, Interconnects / Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Description Conn High Density PL 300 POS 1.27mm Solder ST SMD T/R
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Mount Surface Mount
Mounting Type Surface Mount
Housing Material Polymer

Technical

Packaging Bulk
Series MEG-Array?, MezzSelect?
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Array, Male Pins
Number of Positions 300
Number of Rows 10
Voltage - Rated 200V
HTS Code 8536.69.40.40
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.050 1.27mm
Total Number of Contacts 300
Orientation Straight
Depth 17.34mm
Current Rating 450mA
Contact Finish Gold
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Resistance 35mOhm
Body/Shell Style PLUG
Max Voltage Rating (AC) 200V
Max Current Rating 450mA

Dimensions

Length 44.6mm
Contact Finish Thickness 15.0μin 0.38μm
Height Above Board 0.368 9.35mm
Stack Height (Mating) 10mm 11.5mm 14mm
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