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10022671-102

Amphenol ICC (FCI)
RoHS
/
Package /
Category Connectors, Interconnects / Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Description Conn High Density PL 528 POS 1.27mm Solder ST SMD T/R
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Contact Material COPPER ALLOY
Contact Plating Gold, Lead, Tin
Mount Surface Mount
Mounting Type Surface Mount
Housing Material Polymer

Technical

Packaging Tape & Reel (TR)
Series MEG-Array?, MezzSelect?
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Array, Male Pins
Number of Positions 528
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Rows 12
Voltage - Rated 200V
Additional Feature 250 PCS/REEL
HTS Code 8536.69.40.40
Subcategory Headers and Edge Type Connectors
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.050 1.27mm
Total Number of Contacts 528
Orientation Straight
Depth 19.88mm
Current Rating 450mA
Number of Conductors ONE
Reference Standard UL, CSA
Contact Finish Gold
Reliability COMMERCIAL
Number Of PCB Rows 12
PCB Contact Pattern RECTANGULAR
Mating Information MULTIPLE MATING PARTS AVAILABLE
Body Breadth 0.783 inch
Rated Current (Signal) 0.5A
Contact Style SQ PIN-SKT
Contact Resistance 35mOhm
Insulation Resistance 1GOhm
Body/Shell Style PLUG
Max Voltage Rating (AC) 200V
Max Current Rating 450mA
Polarization Key POLARIZED HOUSING
Dielectric Withstanding Voltage 200VAC V
PCB Contact Row Spacing 1.27 mm
Durability 50 Cycles
Contact Pattern RECTANGULAR
Insertion Force-Max .278 N
Withdrawl Force-Min .1946 N
Mating Contact Row Spacing 0.05 inch

Dimensions

Length 61.88mm
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 30μin
Height Above Board 0.132 3.35mm
Stack Height 6mm

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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