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SPC5777CAK3MME3

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 416-BGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 8MB FLASH 416MAPBGA
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Technical Details

Supply Chain

Factory Lead Time 16 Weeks

Physical

Mounting Type Surface Mount
Package / Case 416-BGA

Technical

Operating Temperature -40°C~125°C TA
Packaging Tray
Series MPC57xx
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 264MHz
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
Core Processor e200z7
Peripherals DMA, LVD, POR, Zipwire
Program Memory Type FLASH
Core Size 32-Bit Tri-Core
Program Memory Size 8MB 8M x 8
Connectivity EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Data Converter A/D 16b Sigma-Delta, eQADC

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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