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SPC5566MZP80
NXP USA Inc.RoHS
/
Package 416-BBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description
32-bit Microcontrollers - MCU BL Auto Micro Processors
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Mounting Type Surface Mount
Package / Case 416-BBGA
Surface Mount YES
Technical
Operating Temperature -40°C~125°C TA
Packaging Tray
Published 2008
Series MPC55xx Qorivva
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 416
HTS Code 8542.31.00.01
Subcategory Microcontrollers
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.5V
Terminal Pitch 1mm
Base Part Number PC5566
JESD-30 Code S-PBGA-B416
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.65V
Power Supplies 1.53.35V
Supply Voltage-Min (Vsup) 1.35V
Oscillator Type External
Number of I/O 256
Speed 80MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.35V~1.65V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor e200z6
Peripherals DMA, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 3MB 3M x 8
Connectivity CANbus, EBI/EMI, Ethernet, SCI, SPI
Supply Current-Max 545mA
Bit Size 32
Data Converter A/D 40x12b
Has ADC YES
DMA Channels YES
PWM Channels YES
Address Bus Width 24
ROM (words) 3145728
Screening Level AEC-Q100
External Data Bus Width 32
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Length 27mm
Width 27mm
Alternative Model
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