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SPC565MZP56D

NXP USA Inc.
RoHS
/
Package 388-BBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 1MB FLASH 388BGA
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Technical Details

Supply Chain

Factory Lead Time 20 Weeks

Physical

Mounting Type Surface Mount
Package / Case 388-BBGA
Surface Mount YES

Technical

Operating Temperature -40°C~125°C TA
Packaging Tray
Published 1999
Series MPC5xx
JESD-609 Code e0
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 388
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Supply Voltage 5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B388
Supply Voltage-Max (Vsup) 5.6V
Supply Voltage-Min (Vsup) 2.6V
Oscillator Type External
Number of I/O 56
Speed 56MHz
RAM Size 36K x 8
Voltage - Supply (Vcc/Vdd) 2.5V~2.7V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor PowerPC
Peripherals POR, PWM, WDT
Clock Frequency 25MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 1MB 1M x 8
Connectivity CANbus, EBI/EMI, SCI, SPI, UART/USART
Bit Size 32
Data Converter A/D 40x10b
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels YES
Address Bus Width 24
External Data Bus Width 32

Dimensions

Height Seated (Max) 2.55mm
Length 27mm
Width 27mm

Compliance

RoHS Status Non-RoHS Compliant
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