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BGM15LBA12E6327XTSA1

Infineon Technologies
RoHS
RoHS RoHS compliant
Package 12-UFQFN Exposed Pad
Category RF/IF and RFID / RF Transceiver Modules
Description MULTI CHIP MODULES
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 12-UFQFN Exposed Pad

Technical

Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Supply 1.7V~3.1V
Frequency 703MHz~960MHz
Data Rate 54Mbps
Protocol 802.11a/b/g/n, Bluetooth v4.0
Power - Output -4dBm
RF Family/Standard Bluetooth
Serial Interfaces SPI, USB
Modulation 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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