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SPC5744PK1AMMM9

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 257-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 2.5MB FLASH 257BGA
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Technical Details

Supply Chain

Factory Lead Time 16 Weeks

Physical

Mounting Type Surface Mount
Package / Case 257-LFBGA

Technical

Operating Temperature -40°C~125°C TA
Packaging Tray
Published 2010
Series MPC57xx
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 200MHz
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 3.15V~5.5V
Core Processor e200z4
Peripherals DMA, LVD, POR, WDT
Program Memory Type FLASH
Core Size 32-Bit Dual-Core
Program Memory Size 2.5MB 2.5M x 8
Connectivity CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Data Converter A/D 64x12b

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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