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SP5744BBK1AMKU6R

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 176-LQFP Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 1.5MB FLASH 176LQFP
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Technical Details

Supply Chain

Factory Lead Time 18 Weeks

Physical

Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Surface Mount YES

Technical

Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series MPC57xx
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.25V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 1.32V
Supply Voltage-Min (Vsup) 1.2V
Oscillator Type Internal
Number of I/O 129
Speed 160MHz
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 3.15V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor e200z4
Peripherals DMA, I2S, POR, WDT
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 1.5MB 1.5M x 8
Connectivity CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Bit Size 32
Data Converter A/D 36x10b, 16x12b
Has ADC YES
DMA Channels YES
PWM Channels NO
EEPROM Size 64K x 8

Dimensions

Length 24mm
Width 24mm

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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