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SP5746CBK1AMMH6R

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 100-LBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 3MB FLASH 100MAPBGA
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 100-LBGA

Technical

Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series MPC57xx
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 80MHz/160MHz
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
Core Processor e200z2, e200z4
Peripherals DMA, LVD, POR, WDT
Program Memory Type FLASH
Core Size 32-Bit Dual-Core
Program Memory Size 3MB 3M x 8
Connectivity CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Data Converter A/D 80x10b, 64x12b

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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