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FS32R372SBK0MMMT

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 257-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description 768KB SRAM 1.3MB FLASH
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Technical Details

Supply Chain

Factory Lead Time 2 Weeks

Technical

Operating Temperature -40°C~125°C TA
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 240MHz
RAM Size 768K x 8
Voltage - Supply (Vcc/Vdd) 1.19V~5.5V
Core Processor e200z7260
Peripherals POR, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit Dual-Core
Program Memory Size 1.3MB 1.3M x 8
Connectivity CANbus, I2C, LINbus, SPI
Data Converter A/D 16x12b SAR
EEPROM Size 32K x 8

Physical

Mounting Type Surface Mount
Package / Case 257-LFBGA

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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