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SAC57D54HCVLTR

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 208-LQFP Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 4MB FLASH 208LQFP
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 208-LQFP Exposed Pad
Surface Mount YES

Technical

Operating Temperature -40°C~105°C TA
Packaging Tape & Reel (TR)
Published 2017
Series MAC57Dxxx
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 1.25V
Terminal Pitch 0.5mm
Supply Voltage-Max (Vsup) 1.32V
Supply Voltage-Min (Vsup) 1.2V
Oscillator Type Internal
Speed 80MHz, 160MHz, 320MHz
RAM Size 2.3M x 8
Voltage - Supply (Vcc/Vdd) 3.15V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM? Cortex?-A5, -M4, -M0+
Peripherals DMA, LCD, LVD/HVD, POR, PWM, WDT
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 32-Bit Tri-Core
Program Memory Size 4MB 4M x 8
Connectivity CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Bit Size 32
Data Converter A/D 24x12b
Has ADC YES
DMA Channels YES
PWM Channels YES

Dimensions

Length 28mm
Width 28mm

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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