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XPC860SRZP66D4

Freescale Semiconductor, Inc. (NXP Semiconductors)
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
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Inventory: 1614
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 357

Compliance

RoHS Status RoHS Compliant

Dimensions

Height Seated (Max) 2.05mm
Length 25mm
Width 25mm

Technical

JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 357
ECCN Code 5A991
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 357
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 66MHz
Bit Size 32
Halogen Free Not Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES

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