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XC6SLX150-N3FG676C

Xilinx
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS OTHER RoHS Compliant BALL field programmable gate array 85C 603kB 1.28ns 806MHz
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Technical Details

Physical

Mount Surface Mount
Package / Case BGA
Number of Pins 676

Dimensions

Height Seated (Max) 2.44mm
Length 27mm
Width 27mm

Technical

JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Number of Outputs 498
Operating Supply Voltage 1.2V
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.21.2/3.32.5/3.3V
Temperature Grade OTHER
Number of I/O 498
RAM Size 603kB
Clock Frequency 806MHz
Propagation Delay 1.28 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 147443
Number of Logic Blocks (LABs) 11519
Number of Registers 184304
Combinatorial Delay of a CLB-Max 0.26 ns

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

Alternative Model

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