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XC2S600E-6FGG676C

Xilinx
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS OTHER RoHS Compliant BALL field programmable gate array 85C 36kB 0.47ns 357MHz
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Technical Details

Physical

Package / Case FBGA
Surface Mount YES

Dimensions

Length 27mm
Width 27mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

Technical

JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 676
Number of Outputs 514
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.89V
Temperature Grade OTHER
RAM Size 36kB
Clock Frequency 357MHz
Number of Inputs 514
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Speed Grade 6
Combinatorial Delay of a CLB-Max 0.47 ns
Number of Logic Cells 15552
Number of Equivalent Gates 210000

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