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XA3S1000-4FG456I

Xilinx
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description RoHS Compliant BALL BOTTOM e0 field programmable gate array 100C 54kB 125MHz 1.2V
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Technical Details

Physical

Mount Surface Mount
Package / Case FBGA
Number of Pins 456

Technical

JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 3
Number of Terminations 456
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Subcategory Field Programmable Gate Arrays
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 456
Number of Outputs 391
Operating Supply Voltage 1.2V
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.21.2/3.32.5V
Number of I/O 333
RAM Size 54kB
Clock Frequency 125MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 17280
Number of Gates 1e+06
Screening Level AEC-Q100
Number of Logic Blocks (LABs) 1920
Speed Grade 4
Number of Equivalent Gates 1000000

Dimensions

Height Seated (Max) 2.6mm
Length 23mm
Width 23mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

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