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IS61NLP25636B-200B3LI

ISSI, Integrated Silicon Solution Inc
RoHS
RoHS RoHS compliant
Package 165-TBGA
Category Integrated Circuits (ICs) / Memory
Description Active BOTTOM Volatile ROHS3Compliant ic memory -40C~85C TA 3.135V 9437184bit 13mm
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 165-TBGA
Surface Mount YES

Dimensions

Height Seated (Max) 1.2mm
Length 15mm
Width 13mm

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, SDR
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B165
Supply Voltage-Max (Vsup) 3.465V
Supply Voltage-Min (Vsup) 3.135V
Memory Size 9Mb 256K x 36
Memory Type Volatile
Clock Frequency 200MHz
Access Time 3.1ns
Memory Format SRAM
Memory Interface Parallel
Organization 256KX36
Memory Width 36
Memory Density 9437184 bit

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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