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RoHS
RoHS RoHS compliant
Package 165-TFBGA
Category Integrated Circuits (ICs) / Memory
Description Synchronous Active 3-STATE BOTTOM ic memory -40C~85C TA 3.135V 4Mb 210mA
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 165-TFBGA
Surface Mount YES
Number of Pins 165

Dimensions

Length 15mm

Compliance

RoHS Status ROHS3 Compliant

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 2 (1 Year)
Number of Terminations 165
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PIPELINED ARCHITECTURE
Technology SRAM - Synchronous, SDR
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 10
Pin Count 165
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
Supply Voltage-Min (Vsup) 3.135V
Memory Size 4.5Mb 256K x 18
Number of Ports 2
Nominal Supply Current 210mA
Memory Type Volatile
Clock Frequency 200MHz
Access Time 3.1ns
Memory Format SRAM
Memory Interface Parallel
Output Characteristics 3-STATE
Memory Width 18
Address Bus Width 18b
Density 4 Mb
Standby Current-Max 0.035A
I/O Type COMMON
Sync/Async Synchronous
Word Size 18b
Standby Voltage-Min 3.14V
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